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RD50 Conference Proceedings

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2024-10-18
06:29
RD50-MPW: a series of monolithic High Voltage CMOS pixel chips with high granularity and towards high radiation tolerance / CERN-RD50 Collaboration
A series of monolithic High Voltage CMOS (HV-CMOS) pixel sensor prototypes have been developed by the CERN-RD50 CMOS working group for potential use in future high luminosity experiments. The aim is to further improve the performance of HV-CMOS sensors, especially in terms of pixel granularity, timing resolution and radiation tolerance. [...]
2024 - 7 p. - Published in : JINST
Fulltext: PDF;
In : Topical Workshop on Electronics for Particle Physics 2023 (TWEPP 2023), Geremeas, Sardinia, Italy, 1 - 6 Oct 2023, pp.C04059

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2024-10-15
06:06
Silicon Detectors for Future Experiments – RD50 Status Report / Baselga, Marta (Dortmund U.) /RD50 Collaboration
In 2001 the Large Hadron Collider (LHC) and High Luminosity Large Hadron Collider (HL-LHC) were facing the challenging construction of experiments that have to withstand radiation levels never dealt with before in a particle detector. The innermost tracking layers, closest to the beam, are expected to reach an instantaneous luminosity of 7.5 × 10$^{34}$ cm$^{-2}$s$^{-1}$, being the result of 200 simultaneous proton-proton interactions per bunch crossing, and fluence levels of 2×10$^{16}$ n$_{eq}$/cm$^2$. [...]
2024 - 7 p. - Published in : PoS VERTEX2023 (2024) 059 Fulltext: PDF;
In : 32nd International Workshop on Vertex Detectors (VERTEX 2023), Sestri Levante, Italy, 16 - 20 Oct 2023, pp.059

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2023-07-19
06:15
Design and Performance of HV CMOS Sensors for Future Colliders by the RD50 Collaboration / Sonneveld, Jory (NIKHEF, Amsterdam) /RD50 Collaboration
The CERN RD50 collaboration develops depleted monolithic active pixel CMOS sensors for future colliders with the aim of high radiation tolerance, good time resolution, and high granularity pixel detectors. The most recent prototype, the RD50-MPW3, is a 150 nm High Voltage CMOS LFoundry chip that features pixels with a 62 $\mu$m pitch that integrate both digital and analog readout electronics inside the sensing diodes. [...]
arXiv:2307.08600.- 2024 - 12 p. - Published in : JPS Conf. Proc. 42 (2024) 011022 Fulltext: document - PDF; 2307.08600 - PDF;
In : The International Workshop on Vertex Detectors (VERTEX 2022), Tateyama, Japan, 24 - 28 Oct 2022, pp.011022

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2023-06-09
06:03
Silicon Detectors for the LHC Phase-II Upgrade and Beyond – RD50 Status Report / Wiehe, Moritz (Freiburg U.) /RD50 Collaboration
A large R&D; program has been underway to develop silicon sensors with sufficient radiation tolerance for LHC-Phase-II trackers and the next generation of collision experiments. Key areas of recent RD50 research include new technologies such as CMOS and Low Gain Avalanche Detectors (LGADs), where a dedicated multiplication layer to create a high field region is built into the sensor. [...]
2022 - 9 p. - Published in : J. Phys. : Conf. Ser. 2374 (2022) 012167 Fulltext: PDF;
In : International Conference on Technology and Instrumentation in Particle Physics (TIPP 2021), Online, Canada, 24 - 29 May 2021, pp.012167

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2023-06-09
04:38
RD50-MPW3: a fully monolithic digital CMOS sensor for future tracking detectors / Sieberer, Patrick (OAW, Vienna) ; Zhang, Chenfan (Liverpool U.) ; Bergauer, Thomas (OAW, Vienna) ; Mohr, Raimon Casanova (Barcelona, IFAE) ; Irmler, Christian (OAW, Vienna) ; Karim, Nissar (Liverpool U.) ; de Cos, Jose Mazorra (Valencia U., IFIC) ; Pilsl, Bernhard (OAW, Vienna) ; Vilella, Eva (Liverpool U.) /CERN-RD50 Collaboration
The CERN-RD50 CMOS working group develops the RD50-MPWseries of monolithic high-voltage CMOS pixel sensors for potential use in future high luminosity experiments such as the HL-LHC and FCC-hh. In this contribution, the design of the latest prototype in this series, RD50-MPW3, is presented. [...]
arXiv:2211.11244.- 2023-02-28 - 7 p. - Published in : JINST 18 (2023) C02061 Fulltext: PDF;
In : Topical Workshop on Electronics for Particle Physics 2022 (TWEPP 2022), Bergen, Norway, 19 - 23 Sep 2022, pp.C02061

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2022-08-10
08:45
Latest Depleted CMOS Sensor Developments in the CERN RD50 Collaboration / Hernández, Ricardo Marco (Valencia U., IFIC) /CERN RD50 Collaboration
This contribution summarizes the most recent activities carried out within the CERN RD50 collaboration with regard to Depleted Monolithic Active Pixel Sensors (DMAPS). In particular, these activities have been focused on the characterization of the RD50-MPW2 prototype. [...]
2021 - 9 p. - Published in : JPS Conf. Proc. 34 (2021) 010008 Fulltext: PDF;
In : 29th International Workshop on Vertex Detectors, Virtual, Japan, 5 - 8 Oct 2020, pp.010008

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2022-08-10
08:45
Low Gain Avalanche Detectors for 4-dimensional tracking applications in severe radiation environments / Currás, Esteban (CERN) /RD50 Collaboration
This paper aims to give an overview of the current status of this technology. The most interesting approaches for future 4-dimensional tracking applications based on the LGAD technology will be presented here. [...]
2021 - 10 p. - Published in : JPS Conf. Proc. 34 (2021) 010015 Fulltext: PDF;
In : 29th International Workshop on Vertex Detectors, Virtual, Japan, 5 - 8 Oct 2020, pp.010015

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2021-01-22
04:13
Pixelated 3D sensors for tracking in radiation harsh environments / Duarte-Campderros, Jordi (Cantabria Inst. of Phys.) /RD50 Collaboration
The High Luminosity upgrade of the CERN Large Hadron Collider will be able to reach a peak instantaneous luminosity of 5E34/cm2 s. The innermost detectors of the CMS and ATLAS experiments will have to cope with unprecedented requirements on radiation hardness. [...]
arXiv:2101.06019.- 2021 - 8 p.
- Published in : JPS Conf. Proc.: 34 (2021) , pp. 010005 Fulltext: 2101.06019 - PDF; document - PDF;
In : 29th International Workshop on Vertex Detectors (VERTEX 2020), Tsukuba, Japan, 5 - 8 Oct 2020, pp.010005

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2020-12-16
06:02
LGAD and 3D as Timing Detectors / Ugobono, Sofia Otero (Barcelona, Inst. Microelectron.) /RD50 Collaboration
In view of the High Luminosity upgrade of the CERN Large Hadron Collider (HL-LHC), radiation tolerant silicon sensors are being developed in the framework of ATLAS, CMS, RD50 and other sensor R\&D; projects. The HL-LHC beam parameters and hardware configuration should enable the collider to reach a peak instantaneous luminosity of $5\times10^{34}\textrm{ cm}^{-2}\textrm{s}^{-1}$, and an integrated luminosity of 250 fb$^{-1}/\textrm{year}$ with the goal of 3000 fb$^{-1}$ after about 12 years of operation. [...]
SISSA, 2019 - 13 p. - Published in : PoS Vertex2019 (2019) 035 Fulltext from Publisher: PDF;
In : Vertex 2019: 28th International Workshop on Vertex Detectors, Lopud Island, Croatia, 13 - 18 Oct 2019, pp.035

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2020-12-16
06:02
Radiation-tolerant Silicon Detectors for the LHC Phase-II Upgrade and Beyond: Review of RD50 Activities / Ott, Jennifer (Helsinki U. ; Helsinki U. of Tech.) /RD50 Collaboration
At the LHC Phase-II Upgrade foreseen for 2027, the particle densities and radiation levels will increase by roughly an order of magnitude compared to the present LHC conditions, and the silicon-based inner tracking systems have to be able to withstand fluences of up to 2$\times$ 16$^{16}$ n$_{eq}$/cm$^{2}$. To mitigate the increased pileup at the HL-LHC, dedicated timing detectors are employed.Within the CERN RD50 Collaboration, a large RD program has been underway for more than a decade across experimental boundaries to develop silicon sensors with sufficient radiation tolerance for HL-LHC tracking and timing detectors. [...]
SISSA, 2020 - 14 p. - Published in : PoS Vertex2019 (2020) 028 Fulltext from Publisher: PDF;
In : Vertex 2019: 28th International Workshop on Vertex Detectors, Lopud Island, Croatia, 13 - 18 Oct 2019, pp.028

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